lyg5292/r1-pf doc. no : qw0905- rev. : date : 11 - jul. - 2007 a data sheet lyg5292/r1-pf dual color led lamps pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only 2.0 18.0min directivity radiation 2.54typ 2.54typ 2.0min 2.0min 1.5 max 9.0 0.5 7.0 0.5 typ 1 2 3 5.0 lyg5292/r1-pf part no. package dimensions 1.cathode green 2.common anode 3.cathode yellow 1 3 2 y g 1/6 page 50% -30 -60 75% 100% 60 50% 25% 0 25%75%100% 30 0
tstg storage temperature -40 ~ +100 forward voltage @20ma(v) 1.7 1.7 min. note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) spectral halfwidth nm peak wave length pnm material part no yellow green emitted lyg5292/r1-pf gap gaasp/gap white diffused lens 56530 58535 color viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) 6.0 6.0 typ. 2.63.0 2.6 max. 3.0 min. 134 134 -40 ~ +85 ratings ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz parameter 20 i f t opr ir pd i fp 10 80 60 symbol y page 2/6 ma 30 10 100 120 a ma mw g unit part no.lyg5292/r1-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip 3/6 page part no.lyg5292/r1-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -40 60 ambient temperature( ) 40 20 0 -20100 80 0.0 ambient temperature( ) 02040 -20 60100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 10 1.0 1000 g chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.5 4.0 forward voltage(v) 2.03.05.0 0.0 1.5 1.0 2.0 100 forward current(ma) 101000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 page 4/6 part no.lyg5292/r1-pf
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max page 5/6 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) part no.lyg5292/r1-pf
mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. reliability test: high temperature high humidity test thermal shock test operating life test high temperature storage test low temperature storage test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test itemtest condition this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. description page 6/6 part no.lyg5292/r1-pf
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